Daniel Siegel Memorial Scholarship

Daniel Siegel Memorial Scholarship provides financial assistance to undergraduate and graduate student members of the Technical Association of the Pulp and Paper Industry (TAPPI) who are interested in preparing for a career in the pulp and paper industry. The $7,000 Daniel Siegel Memorial scholarship is presented in even-numbered years and is funded by an endowment from MICA Corporation and the Siegel family. Applicants must demonstrate an interest in the technological areas covered by the International Flexible Packaging and Extrusion Division of TAPPI, which serves industries including packaging, industrial films and laminations, blown and cast films extrusion, extrusion coatings and laminations, sheet extrusion and printing associated with these areas.